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Results 1 to 25 of 318

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MNE'08. The 34th International Conference on Micro- and Nano-Engineering (MNE)RAPTIS, Ioannis; GOGOLIDES, Evangelos.Microelectronic engineering. 2009, Vol 86, Num 4-6, issn 0167-9317, 1100 p.Conference Proceedings

A novel microfluidic integration technology for PCB-based devices: Application to microflow sensingKONTAKIS, Konstatinos; PETROPOULOS, Anastasios; KALTSAS, Grigoris et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 1382-1384, issn 0167-9317, 3 p.Conference Paper

Plasma Directed Organization of Nanodots on Polymers: Effects of Polymer Type and Etching Time on Morphology and OrderKONTZIAMPASIS, Dimitrios; CONSTANTOUDIS, Vassilios; GOGOLIDES, Evangelos et al.Plasma processes and polymers (Print). 2012, Vol 9, Num 9, pp 866-872, issn 1612-8850, 7 p.Article

The potential of neutral beams for deep silicon nanostructure etching : Neutral Beam ProcessesKOKKORIS, George; TSEREPI, Angeliki; GOGOLIDES, Evangelos et al.Journal of physics. D, Applied physics (Print). 2008, Vol 41, Num 2, issn 0022-3727, 024004.1-024004.6Article

50 years of electron beam lithography: Contributions from Jena (Germany)HAHMANN, Peter; FORTAGNE, Olaf.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 438-441, issn 0167-9317, 4 p.Conference Paper

Multi-level carbon nanotube architectures formed via directed self-assemblyPAPADOPOULOS, C.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 840-843, issn 0167-9317, 4 p.Conference Paper

Projection lithography onto small-diameter copper shafts and fabrication of a micro-axial pumpHORIUCHI, Toshiyuki; HAYASHI, Naoki.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 1176-1178, issn 0167-9317, 3 p.Conference Paper

Towards closed loop control of a plasma tool using OESGOODYEAR, Andrew; COOKE, Mike.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 953-955, issn 0167-9317, 3 p.Conference Paper

Alumina composite suspension preparation for softlithography microfabricationHASSANIN, H; JIANG, K.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 929-932, issn 0167-9317, 4 p.Conference Paper

Simple and reliable technology for manufacturing metal-composite nanomembranes with giant aspect ratioMATOVIC, Jovan; JAKSIC, Zoran.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 906-909, issn 0167-9317, 4 p.Conference Paper

Plasma Etching and Roughening of Thin Polymeric Films : A Fast, Accurate, in situ Method of Surface Roughness MeasurementKOKKORIS, George; VOURDAS, Nikolaos; GOGOLIDES, Evangelos et al.Plasma processes and polymers (Print). 2008, Vol 5, Num 9, pp 825-833, issn 1612-8850, 9 p.Article

Fabrication and tests of a novel three dimensional micro supercapacitorWEI SUN; XUYUAN CHEN.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 1307-1310, issn 0167-9317, 4 p.Conference Paper

Nanoimprint with thin and uniform residual layer for various pattern densitiesHIROSHIMA, Hiroshi.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 611-614, issn 0167-9317, 4 p.Conference Paper

Superhydrophobic, passive microvalves with controllable opening threshold: exploiting plasma nanotextured microfluidics for a programmable flow switchboardELLINAS, Kosmas; TSEREPI, Angeliki; GOGOLIDES, Evangelos et al.Microfluidics and nanofluidics (Print). 2014, Vol 17, Num 3, pp 489-498, issn 1613-4982, 10 p.Article

Lithographic importance of base diffusion in chemically amplified photoresistsSCHNATTINGER, Thomas; ERDMANN, Andreas.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 773-775, issn 0167-9317, 3 p.Conference Paper

Nanomanufacturing of random branching material architecturesDOUMANIDIS, Charalabos C.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 467-478, issn 0167-9317, 12 p.Conference Paper

NGL comparable to 193-nm lithography in cost, footprint, and power consumptionLIN, Burn J.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 442-447, issn 0167-9317, 6 p.Conference Paper

Preparation methods and characteristics of fluorinated polymers for mold replicationTSUNOZAKI, Kentaro; KAWAGUCHI, Yasuhide.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 694-696, issn 0167-9317, 3 p.Conference Paper

A global model for C4F8 plasmas coupling gas phase and wall surface reaction kineticsKOKKORIS, George; GOODYEAR, Andy; COOKE, Mike et al.Journal of physics. D, Applied physics (Print). 2008, Vol 41, Num 19, issn 0022-3727, 195211.1-195211.12Article

Effects of model polymer chain architectures and molecular weight of conventional and chemically amplified photoresists on line-edge roughness. Stochastic simulationsPATSIS, George P; GOGOLIDES, Evangelos.Microelectronic engineering. 2006, Vol 83, Num 4-9, pp 1078-1081, issn 0167-9317, 4 p.Conference Paper

Nano-texturing of poly(methyl methacrylate) polymer using plasma processes and applications in wetting control and protein adsorptionTSOUGENI, Katerina; PETROU, Panayiota S; TSEREPI, Angeliki et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 1424-1427, issn 0167-9317, 4 p.Conference Paper

Superhydrophobic, hierarchical, plasma-nanotextured polymeric microchannels sustaining high-pressure flowsPAPAGEORGIOU, Dimitrios P; TSOUGENI, Katerina; TSEREPI, Angeliki et al.Microfluidics and nanofluidics (Print). 2013, Vol 14, Num 1-2, pp 247-255, issn 1613-4982, 9 p.Article

Contact line dynamics of a superhydrophobic surface: application for immersion lithographyGNANAPPA, Arun Kumar; GOGOLIDES, Evangelos; EVANGELISTA, Fabrizio et al.Microfluidics and nanofluidics (Print). 2011, Vol 10, Num 6, pp 1351-1357, issn 1613-4982, 7 p.Article

Application of the Kriging method to the reconstruction of ellipsometric signatureAFRAITES, L; HAZART, J; SCHIAVONE, P et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 1033-1035, issn 0167-9317, 3 p.Conference Paper

Consequences of non-standard bleaching on microlithographic performanceFULGA, Florin; NICOLAU, Dan V.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 783-786, issn 0167-9317, 4 p.Conference Paper

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